Apple some time ago had expressed their desire that the size of the SIM card can be made smaller than Micro-SIM used in iPhone 4 and 4S. The German technology company Giesecke & Devriant announced yesterday, a SIM card berkuruan only two-thirds smaller than the Micro-SIM devices that allow manufacturers to produce thinner and thinner.
Nano-SIM started to be applied to new possibilities in mobile devices early next year. While the relationship between Apple and G & D is not yet clear, but the Nano-SIM technology is likely to be used in next-generation iPhone.
Technically, this is the first time a significant change in the SIM circuit in the last 20 years. This is because, Micro-SIM has a thickness equal to the ordinary SIM only shape are minimized, allowing anyone to make the ordinary into the Micro SIM-SIM with SIM cutter. While the usual SIM card may not be converted into Nano-SIM.
According to G & D, Nano-sized SIM approximately 12x9mm or 30 percent less than the Micro-SIM. Thickness of the card is also very significantly reduced by about 15 percent, considering how thin the SIM card currently outstanding.
Compared with ordinary SIM card that is widely used today, a total of about 60 Nano-SIM persn smaller. That is, the Nano-SIM device manufacturers benefit of providing additional space for other components, such as additional memory or a larger battery capacity or can make mobile devices become increasingly thin.
G & D states, Nono-SIM has been undergoing trials in a variety of mobile network operators and expected standardization will be done through the European Telecommunications Standards Institute (ETSI) at the end of the year.
Nano-SIM will be compatible with older devices using adapter solution. This is to ensure the Nano-SIM can be integrated on all GSM-based mobile devices that exist. New SIM card will be exhibited at a trade show Europe that began on 15 November.
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